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PCB Capabilities
| ITEMS | STANDARD PROCESS | ADVANCED PROCESS AND SPECIAL FEATURES |
|---|---|---|
| Materials | FR4-Tg170°C | FR4 Tg-140°C |
| FR4-Tg170°C | FR4-Tg170°C | |
| Rogers (3000 series, 4000 series) | ||
| FR4-Rogers Hybrid (>=4 layers) | ||
| Aluminum | ||
| Fabrication Standard | IPC-A-600F Class 2 | IPC-A-600F Class 2, 3 |
| For FR4 materials below | ||
| Max. layers | 8 layers | 22 layers |
| Max. board size | 12” x 14”, total area <=168 sq in | 14” x 18” |
| Min. board size | ||
| Thickness | 0.024”-0.124” | 0.016”-0.186” |
| Copper Weight-Outer | 1oz, 2oz | 1oz, 1.5oz, 2oz, 3oz, 4oz, 5oz |
| Copper Weight-Inner | 0.5oz, 1oz, 2oz | 0.5oz, 1oz, 2oz, 3oz, 4oz |
| Finish | Hot Air Solder Leveling (HASL) | Hot Air Solder Leveling (HASL) |
| Lead-free HASL | Lead-free HASL | |
| Immersion Gold (ENIG) | Immersion Gold (ENIG) | |
| Immersion Tin | Immersion Tin | |
| Immersion Silver | Immersion Silver | |
| Nickel-Palladium Immersion Gold (ENEPIG) | ||
| Hard Plated Gold (20u”, 30u”, 50u”) | ||
| Outer layer min. Trace Width/Spacing | 6mil (1oz Copper) 8mil (2oz Copper) | 4mil (1oz Copper) 6mil (2oz Copper) 9mil (3oz Copper) 12mil (4oz Copper) |
| Inner layer min. Trace Width/Spacing | 6mil (1oz Copper) 8mil (2oz Copper) | 3mil/4mil (1/2oz Copper) 4mil/5mil (1oz Copper) 6mil/7mil (2oz Copper) 9mil/11mil (3oz Copper) 12mil/14mil (3oz Copper) |
| Min. Annular Ring width | 6mil | 4 mil |
| Min. Hole Size | 0.010”-0.200” | 0.008”-0.200” |
| Hole size tolerance | 0.003” | 0.002” |
| Max. hole aspect ratio | 7 :1 | 8 :1 |
| Blind/Buried vias | No | Yes |
| Min. copper to board edge clearance | 10mil | 8mil |
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| Solder Mask Material | Liquid photo imageable | Liquid photo imageable |
| Solder Mask Colors | Green / blue / red / black / white | Green / blue / red / black / white |
| Solder Mask Registration Variation | 2 mil | 2 mil |
| Min. Solder Bridge Width | 5 mil | 5 mil |
| Silkscreen material | Epoxy thermal cure | Epoxy thermal cure |