We provide full range of PCB/FPC manufacturing and assembly services to fit all of your printed circuit board capability needs. Lorem ipsum dolor sit amet, consectetur adipiscing elit, sed do eiusmod tempor incididunt ut labore et dolore magna aliqua. Ut enim ad minim veniam, quis nostrud exercitation ullamco laboris nisi ut aliquip ex ea commodo consequat. Duis aute irure dolor in reprehenderit in voluptate velit esse cillum dolore eu fugiat nulla pariatur.
FPC Capabilities
| ITEMS | Capabilities |
|---|---|
| Materials | PI |
| Fabrication Standard | IPC-A-600F Class 2 |
| Max. board size | 10” x 14”, total area <=168 sq in |
| Min. board size | |
| Thickness | 0.006”-0.012” |
| Copper Weight | 0.5oz-2oz |
| Finish | Immersion Gold (ENIG) |
| Hot Air Solder Leveling (HASL) | |
| Lead-free HASL | |
| Immersion Tin | |
| Nickel-Palladium Immersion Gold (ENEPIG) |
|
| Outer layer min. Trace Width/Spacing | 4mil (1oz Copper) 6mil (2oz Copper) |
| Inner layer min. Trace Width/Spacing | 4mil (1/2oz Copper) 6mil (1oz Copper) 8mil (2oz Copper) |
| Min. Annular Ring width | |
| Min. Hole Size | 0.008”-0.200” |
| Hole size tolerance | 0.003” |
| Min. copper to board edge clearance | 10mil |
| Solder Mask Material | Liquid photo imageable |
| Coverlay | |
| Solder Mask Colors | Green / blue / red / black / white/clear |
| Solder Mask Registration Variation | |
| Min. Solder Bridge Width | |
| Silkscreen material | Epoxy thermal cure |
| Silkscreen colors | White, yellow, black |
| Silkscreen line width | 6mil |
| Min. letter height | 0.040” |
| Min. letter width | 0.025” |
| Impedance Control | Yes |
| Routing | Individual routing |
| Tab routing | |
| Internal cut-out | |
| Featured holes | Slot holes |
| Non-plated holes | |
| Via | Via tenting |
| Via plug | |
| Marking | UL, Lot code, Date code |